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DMN4800LSSL Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN4800LSSL Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() DMN4800LSSL Document number: DS35016 Rev. 3 - 2 2 of 6 www.diodes.com October 2011 © Diodes Incorporated DMN4800LSSL Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±20 V Drain Current (Note 4) VGS = 10V Steady State TA = 25°C TA = 70°C ID 8.0 6.4 A Drain Current (Note 4) VGS = 10V Steady State TA = 25°C TA = 70°C ID 6.7 5.3 A Pulsed Drain Current (Note 5) IDM 50 A Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Total Power Dissipation (Note 4) PD 1.46 W Thermal Resistance, Junction to Ambient RθJA 86 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BVDSS 30 ⎯ ⎯ V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current IDSS ⎯ ⎯ 1 μA VDS = 30V, VGS = 0V Gate-Source Leakage IGSS ⎯ ⎯ ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage VGS(th) 0.8 1.2 1.6 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS (ON) ⎯ 11 14 14 20 m Ω VGS = 10V, ID = 8A VGS = 4.5V, ID = 7A Forward Transconductance gfs ⎯ 8 ⎯ S VDS = 10V, ID = 8A Diode Forward Voltage (Note 6) VSD ⎯ 0.72 0.94 V VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS Input Capacitance Ciss ⎯ 798 ⎯ pF VDS = 10V, VGS = 0V f = 1.0MHz Output Capacitance Coss ⎯ 128 ⎯ pF Reverse Transfer Capacitance Crss ⎯ 122 ⎯ pF Gate Resistance RG ⎯ 1.37 ⎯ Ω VDS = 0V, VGS = 0V, f = 1.0MHz Total Gate Charge Qg ⎯ 8.7 ⎯ nC VGS = 5V, VDS = 15V, ID = 9A Gate-Source Charge Qgs ⎯ 1.7 ⎯ Gate-Drain Charge Qgd ⎯ 2.4 ⎯ Turn-On Delay Time td(on) ⎯ 5.03 ⎯ ns VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6.0Ω, ID = 1A Rise Time tr ⎯ 4.50 ⎯ Turn-Off Delay Time td(off) ⎯ 26.33 ⎯ Fall Time tf ⎯ 8.55 ⎯ Notes: 4. Device mounted on FR-4 PCB, with minimum recommended pad layout. 5. Repetitive rating, pulse width limited by junction temperature. 6. Short duration pulse test used to minimize self-heating effect. |
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