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M68ICS08GR Datasheet(PDF) 388 Page - Freescale Semiconductor, Inc |
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M68ICS08GR Datasheet(HTML) 388 Page - Freescale Semiconductor, Inc |
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388 / 408 page  Mechanical Specifications Technical Data MC68HC908GR8 — Rev 4.0 388 Mechanical Specifications MOTOROLA 24.3 32-Pin LQFP (Case #873A) A - U - V - Z - S B - T - DETAIL Y Section AE–AE G -AC- DETAIL AD Seating plane 8x M ° R Q ° K W X A1 S1 1 8 9 17 25 32 9 V1 B1 0.20 (0.008) AC T-U Z 4X 0.20 (0.008) AB T-U Z 4X -AB- 0.10 (0.004) AC C E H DETAIL AD F N D J Base Metal AE AE DETAIL Y P NOTES: 1. DIMENSIONS AND TOLERANCING AS PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: MILLIMETER 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS CONSISTENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB- 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC- 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB- 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020) 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003) 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION DIM MILLIMETERS INCHES MIN MAX MIN MAX A 7.000 BSC 0.276 BSC A1 3.500 BSC 0.138 BSC B 7.000 BSC 0.276 BSC B1 3.500 BSC 0.138 BSC C 1.400 1.600 0.055 0.063 D 0.300 0.450 0.012 0.018 E 1.350 1.450 0.053 0.057 F 0.300 0.400 0.012 0.016 G 0.800 BSC 0.031 BSC H 0.050 0.150 0.002 0.006 J 0.090 0.200 0.004 0.008 K 0.500 0.700 0.020 0.028 M 12 ° REF 12 ° REF N 0.090 0.160 0.004 0.006 P 0.400 BSC 0.016 BSC Q 1 ° 5 ° 1 ° 5 ° R 0.150 0.250 0.006 0.010 S 9.000 BSC 0.354 BSC S1 4.500 BSC 0.177 BSC V 9.000 BSC 0.354 BSC V1 4.500 BSC 0.177 BSC W 0.200 REF 0.008 REF X 1.000 REF 0.039 REF Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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