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AD8332ACP-R2 Datasheet(PDF) 53 Page - Analog Devices |
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AD8332ACP-R2 Datasheet(HTML) 53 Page - Analog Devices |
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53 / 56 page ![]() AD8331/AD8332/AD8334 Rev. G | Page 53 of 56 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-153-AE 28 15 14 1 8° 0° SEATING PLANE COPLANARITY 0.10 1.20 MAX 6.40 BSC 0.65 BSC PIN 1 0.30 0.19 0.20 0.09 4.50 4.40 4.30 0.75 0.60 0.45 9.80 9.70 9.60 0.15 0.05 Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP) (RU-28) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-137-AD CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 20 11 10 1 SEATING PLANE 0.010 (0.25) 0.004 (0.10) 0.012 (0.30) 0.008 (0.20) 0.025 (0.64) BSC 0.041 (1.04) REF 0.010 (0.25) 0.006 (0.15) 0.050 (1.27) 0.016 (0.41) 0.020 (0.51) 0.010 (0.25) 8° 0° COPLANARITY 0.004 (0.10) 0.065 (1.65) 0.049 (1.25) 0.069 (1.75) 0.053 (1.35) 0.345 (8.76) 0.341 (8.66) 0.337 (8.55) 0.158 (4.01) 0.154 (3.91) 0.150 (3.81) 0.244 (6.20) 0.236 (5.99) 0.228 (5.79) Figure 123. 20-Lead Shrink Small Outline Package (QSOP) (RQ-20) Dimensions shown in Inches and (millimeters |
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