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Document Number: 28758

344

Revision: 27-Jun-12

TNPW e3

Vishay

High Stability Thin Film Flat Chip Resistors

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

4.17.2

58 (Td)

Solderability

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

Good tinning (

 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux

(235 ± 3) °C; (2 ± 0.2) s

4.18.2

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

±

(0.02 % R +0.01)

4.29

45 (XA)

Component

solvent

resistance

Isopropyl alcohol + 50 °C;

method 2

No visible damage

4.32

Shear

(adhesion)

RR 1005M and RR 1608M;

9 N

No visible damage

RR 2012M and RR 3216M:

45 N

4.33

Substrate

bending

Depth 2 mm, 3 times

±

(0.05 % R +0.01)

no visible damage, no open circuit in bent position

4.7

-

Voltage proof

No flashover or breakdown

4.35

-

Flammability

IEC 60695-11-5,

needle flame test; 10 s

No burning after 30 s

-

-

Damp heat

(85 ±

5) °C; 56 days

(85 ±

5) % RH

± (0.25 R + 0.05

)

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC 60068-2

TEST METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE

Stability for product types:

TNPW0402 e3

TNPW0603 e3

TNPW0805 e3

TNPW1206 e3

TNPW1210 e3

TNPW2010 e3

TNPW2512 e3