PIC16F1825T-ESS datasheet(359/448 Pages) MICROCHIP

359 / 448 page

 2010-2012 Microchip Technology Inc.

DS41440C-page 359

PIC16(L)F1825/1829

30.6

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C

 TA  +125°C

Param

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance Junction to Ambient

70.0

C/W

14-pin PDIP package

95.3

C/W

14-pin SOIC package

100

C/W

14-pin TSSOP package

45.7

C/W

16-pin QFN (4x4) package

62.2

C/W

20-pin PDIP package

77.7

C/W

20-pin SOIC package

87.3

C/W

20-pin SSOP package

43.0

C/W

20-pin QFN (4x4) package

TH02

JC

Thermal Resistance Junction to Case

32.8

C/W

14-pin PDIP package

31.0

C/W

14-pin SOIC package

24.4

C/W

14-pin TSSOP package

6.3

C/W

16-pin QFN (4x4) package

27.5

C/W

20-pin PDIP package

23.1

C/W

20-pin SOIC package

31.1

C/W

20-pin SSOP package

5.3

C/W

20-pin QFN (4x4) package

TH03

TJMAX

Maximum Junction Temperature

150

C

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD(1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TJ - TA)/

JA(2,3)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature

3: TJ = Junction Temperature

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