102

11

RoHS Compliant, ELV Compliant

HF Halogen Free

Family Performance Curves

... Cont’d

Figure FF1-FF6

0.1

10

1100

10

1

0.1

0.01

0.001

Current (A)

1206SFF Average Time Current Curves

A

B CD E F G H IJK L M

A = 0.5A

B = 0.7A

C = 1.0A

D = 1.5A

E = 1.7A

F = 2.0A

G = 2.5A

H = 3.0A

I

= 4.0A

J = 5.0A

K = 6.0A

L = 7.0A

M = 8.0A

10000

1000

100

10

1

0.1

0.01

0.001

Time (s)

1206SFF I²t vs. t Curves

0.001

0.01

0.1

1

10

A

B

C

D

E

F

G

H

I

J

K

L

M

A =

0.5A

B = 0.75A

C =

1.0A

D =

1.5A

E = 1.75A

F =

2.0A

G =

2.5A

H =

3.0A

I

=

4.0A

J =

5.0A

K =

6.0A

L =

7.5A

M =

8.0A

Figure FF6

Figure FF5

Operating temperature

-55°C to +125°C

Mechanical vibration

Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202

Mechanical shock

Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202

Thermal shock

Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202

Resistance to soldering heat

Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202

Solderability

Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202

Moisture resistance

Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202

Salt spray

Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202

Construction body material

Ceramic

Termination material

Silver, Nickel, Tin

Fuse element

Silver

105

100

95

90

85

80

75

70

65

60

55

50

45

40

35

30

25

20

15

10

5

0

Maximum Operating Temperature (˚C)

-55

-35

-15

5

25

45

65

85

105

125

145

Temperature Effect on Current Rating

Environmental Specifications for Fast-Acting Chip Fuses

Table FF3

Material Specifications for Fast-Acting Chip Fuses

Table FF4

Thermal Derating Current for Fast-Acting Chip Fuses

Figure FF7

Note: Curves are nominal