MRW3001 MRW3003 MRW3005

2–4

MOTOROLA RF DEVICE DATA

MRW3005

TYPICAL CHARACTERISTICS

10

8

6

4

2

0

0.2

2 GHz

1.5 GHz

0.6

1

1.4

1.8

2.2

2.6

f = 3 GHz

2.3 GHz

14

1

f, FREQUENCY (GHz)

1.5

2

2.5

3

3.5

60

40

20

ηc @ 5 W

Po(sat)

12

10

8

6

4

3

2.3

f = 1.5 GHz

2

3

2.3

0.4

0.6 0.8 1.0

1.5

2

3 4 5

10

0.2

2

f = 1.5 GHz

Zo = 50 Ω

ZOL*

Zin

Psat, SATURATED OUTPUT POWER (WATTS)

Figure 7. Output Power versus Input Power

Figure 8. Psat and η versus Frequency

Figure 9. Series Equivalent Input/Output Impedance

The graph shown displays MTTF in hours x ampere2 emitter current

for each of the 3.0 GHz devices. Life tests at elevated temperatures

have correlated to better than

±10% to the theoretical prediction for

metal failure. CAUTION — A calculation is required to obtain actual

metal life. Sample MTTF calculations based on operating conditions

are shown below.

Junction Temperature —

°C

To calculate metal lifetime under any set of conditions, obtain actual

data or estimate from typical performance curves. Solve for TJ (°C):

Pout x 100

hc %

(1) TJ = θJF

MTTF Factor

(Normalized to 1.0 ampere2 Continuous Duty)

+ Pin – Pout + TFLANGE

Enter graph of MTF factor versus TJ. Obtain MTF factor. Calculate

metal life by:

(2) Metal Life in Hours =

MTF Factor

IC2 (Amps)

10,000,000

1,000,000

100,000

10,000

1,000

100

230

210

190

170

150

130

110

90

TJ, JUNCTION TEMPERATURE (°C)

MRW3005

MRW3003

MRW3001

Figure 10. MTTF Factor versus

Junction Temperature