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PIC10LF322T-EMCSQTP Datasheet(PDF) 178 Page - Microchip Technology |
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PIC10LF322T-EMCSQTP Datasheet(HTML) 178 Page - Microchip Technology |
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178 / 210 page ![]() PIC10(L)F320/322 DS41585A-page 178 Preliminary 2011 Microchip Technology Inc. 24.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Typ. Units Conditions TH01 JA Thermal Resistance Junction to Ambient 60 C/W 6-pin SOT-23 package 80 C/W 8-pin PDIP package 90 C/W 8-pin DFN package TH02 JC Thermal Resistance Junction to Case 31.4 C/W 6-pin SOT-23 package 24 C/W 8-pin PDIP package 24 C/W 8-pin DFN package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/ JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature |
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