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Custom Power Modules

Microsemi PMP has created the Application Specific Power Module (ASPM) concept and has been offering customized power modules since 1983. Microsemi PMP offers a

complete engineered solution with mix and match capabilities in term of package, configuration, performance and cost.

3 levels of customization are proposed offering different cost and low volume entry:

Change Options:

Die

Substrate

Base plate

Plastic lid

Terminals

NRE level

MOQ

Elect./thermal performance

Die P/N

Material

Material

-

-

None to low

5 to 10

pieces

Elect./thermal performance

+ electrical configuration

Die P/N

Material & Layout

Material

-

-

Low to medium

Elect./thermal performance

+ electrical configuration

+ module housing

Die P/N

Material & Layout

Material & Shape

Material & Shape

Shape

Medium to high

Microsemi PMP power modules are made of different sub-elements. Most of them are standard and can be re-used to build infinite solutions for the end user.

Microsemi PMP offers optimum development cost and cycle time thanks to long term experience and wide range of available technologies.

Power Modules Features

Customer Benefits

High Power Density

Size and cost reduction

Isolated and highly thermally conductive substrate

Excellent thermal management

Internal wiring

Reduced external hardware

Minimum parasitics

Improved performance

Minimum output terminals

Reduced assembly time

Mix & match components

Optimizes losses

Full engineered solutions

Easy upgrade/less parts counts/short time to market/IP protection

Great level of integration

Mix of Silicon within the same package

No quantity limitation

Application oriented

Standard and custom packages

Standard and custom terminals

Various substrate technologies

Coefficient of thermal expansion matching

FLEXIBILITY

TECHNOLOGY

PACKAGING CAPABILITY

RELIABILITY

APPLICATIONS

Solar - Welding - Plasma Cutting - Semicap - MRI & Xray - EV/HEV - Induction Heating - UPS - Motor control - Data Communication

Internal Printed Circuit Board

Not available in all modules.

Used to route gate signals tracks to small

signal terminals

Used to mount gate circuit and protection in

case of intelligent power module

Terminals

Screw on or Solder pins

Provides the user with power and signal

connections with minimum parasitic

resistance and inductance

Substrates

Al2O3, AlN, Si3N4

Provide isolation and good heat

transfer to the base plate

Package

Standard or Custom

Ensure environmental protection and

mechanical robustness

Power Semiconductor Die

IGBT, Mosfet, Diode, SiC, Thyristor,

Switching devices soldered to the

substrates and connected by ultrasonic

Al wire bonds

Base Plate

Improve the heat transfer to the heat sink

Copper for good thermal transfer

AlSiC, CuW, CuMoCu for improved

reliability