AD8557ACPZ-R2 datasheet(21/24 Pages) AD

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AD8557

Rev. C | Page 21 of 24

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 48. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.35

0.30

0.25

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

PIN 1

INDICATOR

0.50

0.40

0.30

0.25 MIN

2.50

2.35 SQ

2.20

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-10)

Dimensions shown in millimeters

AD8557ACPZ-R2 Datasheet(PDF) 21 Page - Analog Devices

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