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PIC18F4550ESOSQTP Datasheet(PDF) 368 Page - Microchip Technology |
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PIC18F4550ESOSQTP Datasheet(HTML) 368 Page - Microchip Technology |
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368 / 430 page ![]() PIC18F2455/2550/4455/4550 DS39632D-page 366 Preliminary © 2007 Microchip Technology Inc. Supply Current (IDD)(2) PIC18LFX455/X550 2.9 8 μA-40°C VDD = 2.0V FOSC = 31 kHz (RC_IDLE mode, INTRC source) 3.1 8 μA+25°C 3.6 11 μA+85°C PIC18LFX455/X550 4.5 11 μA-40°C VDD = 3.0V 4.8 11 μA+25°C 5.8 15 μA+85°C All devices 9.2 16 μA-40°C VDD = 5.0V 9.8 16 μA+25°C 11.4 36 μA+85°C PIC18LFX455/X550 165 350 μA-40°C VDD = 2.0V FOSC = 1 MHz (RC_IDLE mode, INTOSC source) 175 350 μA+25°C 190 350 μA+85°C PIC18LFX455/X550 250 500 μA-40°C VDD = 3.0V 270 500 μA+25°C 290 500 μA+85°C All devices 0.50 1 mA -40°C VDD = 5.0V 0.52 1 mA +25°C 0.55 1 mA +85°C PIC18LFX455/X550 340 500 μA-40°C VDD = 2.0V FOSC = 4 MHz (RC_IDLE mode, INTOSC source) 350 500 μA+25°C 360 500 μA+85°C PIC18LFX455/X550 520 900 μA-40°C VDD = 3.0V 540 900 μA+25°C 580 900 μA+85°C All devices 1.0 1.6 mA -40°C VDD = 5.0V 1.1 1.5 mA +25°C 1.1 1.4 mA +85°C 28.2 DC Characteristics: Power-Down and Supply Current PIC18F2455/2550/4455/4550 (Industrial) PIC18LF2455/2550/4455/4550 (Industrial) (Continued) PIC18LF2455/2550/4455/4550 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2455/2550/4455/4550 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Device Typ Max Units Conditions Legend: TBD = To Be Determined. Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. |
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