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DSPIC33FJ64GP706 Datasheet(PDF) 306 Page - Microchip Technology

Part # DSPIC33FJ64GP706
Description  High-Performance 16-Bit Digital Signal Controllers
PDF  322 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC33FJ64GP706 Datasheet(HTML) 306 Page - Microchip Technology

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dsPIC33FJXXXGPX06/X08/X10
DS70286C-page 304
© 2009 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
100
Lead Pitch
e
0.50 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
16.00 BSC
Overall Length
D
16.00 BSC
Molded Package Width
E1
14.00 BSC
Molded Package Length
D1
14.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
D
D1
e
b
E1
E
N
NOTE 1
NOTE 2
12 3
c
L
A1
L1
A2
A
φ
β
α
Microchip Technology Drawing C04-110B



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