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Revision 2.3

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AS8525

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 8 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Typ

Max

Units

Comments

VSUP

Supply voltages

-0.3

42

V

Maximum allowed potential difference

between any two pins in the set HRSHH,

HRSHL and VSUP2 is 0.3V

VSUP2

-27

42

VBAT,

HRSHH,

HRSHL

Battery voltage inputs

-27

42

V

EN

Enable input

-0.3

42

V

VCC,

AVCC

Regulated output supplies

-0.3

7

V

LIN

LIN bus

-27

40

V

Analog & digital inputs and

outputs

-0.3

7

V

Input current (latchup immunity)

-100

100

mA

Norm: AEC-Q100

ESD

Electrostatic Discharge

1

Norm: AEC-Q100

1. ESD Human Body model: R=1500

Ω and C=150pF

±2

kV

For VCC, AVCC, TX, RX, Reset, CS, SCLK,

SDO, SDI, EN, VBAT_DIV, VBAT_DIVN,

LRSHH, LRSHL, VBG_IN, CLK, INT, MEN

±4

VSUP, VSUP2, VBAT, HRSHH, HRSHL

±8

LIN to VSS1, HBM Model

±6

LIN to VSS1, IEC6100-4-2

±0.5

LIN to VSS1, CDM

±0.1

LIN to VSS1, MM

Total operating power

dissipation (all supplies and

outputs)

1W

QFN 32 in still air, soldered on JEDEC

standard board @125º ambient, static

operation = no time limit

Package thermal resistance

25

ºC/W

Storage temperature

-55

+150

ºC

Package body temperature

+260

ºC

The reflow peak soldering temperature

(body temperature) is specified according

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non hermetic

Solid State Surface Mount Devices”.

Humidity non-condensing

5

85

%