1

4

3

2

DS30EA101

(top view)

12

9

10

11

8

5

6

7

13

16

15

14

IN-

IN+

OUT+

OUT-

DS30EA101

SNLS404A – FEBRUARY 2012 – REVISED APRIL 2013

www.ti.com

Connection Diagram

The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative

power supply voltage.

Figure 1. 16-Pin WQFN Package

See Package Number RUM0016A

PIN DESCRIPTIONS

Pin

Name

I/O, Type

Description

1

Ground

Negative power supply (ground).

2

IN+

I, Data

Non-inverting input.

3

IN-

I, Data

Inverting input.

4

Ground

Negative power supply (ground).

5

DNC

N/A

Do not connect – leave open.

6

DNC

N/A

Do not connect – leave open.

7

Ground

Negative power supply (ground).

8

Ground

Negative power supply (ground).

9

Ground

Negative power supply (ground).

10

OUT-

O, LVDS

Inverting output.

11

OUT+

O, LVDS

Non-inverting output.

12

Ground

Negative power supply (ground).

13

Power

Positive power supply (+2.5V).

14

EN

I, LVCMOS

Output enable. LOS may be tied to this pin to inhibit the output when no input signal is

present. This pin has an internal pulldown.

H = Outputs disabled.

L = Outputs enabled.

15

LOS

O, LVCMOS

Loss of signal.

H = No input signal detected.

L = Input signal detected.

16

Power

Positive power supply (+2.5V).

DAP

Ground

Connect exposed DAP to negative power supply (ground).

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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