LP3872EMP-2.5SLASHNOPB datasheet(13/25 Pages) TI1

13 / 25 page

LP3872, LP3875

www.ti.com

SNVS227F – FEBRUARY 2003 – REVISED APRIL 2013

Figure 21.

θJA vs Copper (1 Ounce) Area for DDPAK/TO-263 package

As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The

minimum value for

θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.

Figure 22 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient

temperatures, assuming

θJA is 35°C/W and the maximum junction temperature is 125°C.

Figure 22. Maximum power dissipation vs ambient temperature for DDPAK/TO-263 package

HEATSINKING SOT-223 PACKAGE

Figure 23 shows a curve for the

θJA of SOT-223 package for different copper area sizes, using a typical PCB with

1 ounce copper and no solder mask over the copper area for heat sinking.

Figure 23.

θJA vs Copper(1 Ounce) Area for SOT-223 package

The following figures show different layout scenarios for SOT-223 package.

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LP3872EMP-2.5/NOPB Datasheet(PDF) 13 Page - Texas Instruments