1

GaAs SPDT Switch

DC - 4.0 GHz

Rev. V4

MASW4030G

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

• Absorbtive or Reflective

• Excellent Intermodulation Products

• Excellent Temperature Stability

• Fast Switching Speed: 3 ns Typical

• Ultra Low DC Power Consumption

• Independent Bias Control

Description

The

MASW4030G

is

an

SPDT

absorptive

or

reflective GaAs MESFET MMIC. This part combines

small

size,

low

insertion

loss

and

power

consumption with high isolation. Ideal for many

applications and module use. It will function well for

designs below 4.0 GHz.

The MASW4030G is fabricated using a mature

1-micron gate length GaAs MESFET process. The

process features full chip passivation for increased

performance and reliability.

Ordering Information

Part Number

Package

MASW4030G

DIE

Bond Pad Dimensions

Schematic

Pad Layout

G1

RF

G1

RF1

RF2

B

A

B

C

A

C

G2

G2

G1

RF

G1

RF1

RF2

B

A

B

C

A

C

G1

RF

G1

RF1

RF2

B

A

B

C

A

C

G2

G2

Control Value (A or B)

-8.5 Vdc

Max Input RF Power

+34.0 dBm

(500 MHz - 4 GHz)

Storage Temperature

-65°C to +175°C

Operating Temperature

+175°C

Parameter

Absolute Maximum

Absolute Maximum Rating

1,2

1. Exceeding any one or combination of these limits may cause

permanent damage to this device.

2. M/A-COM Technology Solutions does not recommend

sustained operation near these survivability limits.

Bond Pad

Dimensions - Inches (mm)

G1

0.004 x 0.008 (0.100 x 0.200)

RF1, RF2

0.004 x 0.008 (0.100 x 0.200)

T

0.0065 x 0.13 (0.165 x 0.330)

A, B, Ac, Bc, G2

0.004 x 0.004 (0.100 x 0.100)

RF

0.008 x 0.006 (0.200 x 0.150)

T

T

Die Size - Inches (mm)

0.042 x 0.040 x 0.010 (1.065 x 1.015 x 0.25)