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2N7002KB Datasheet(PDF) 2 Page - Silikron Semiconductor Co.,LTD. |
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2N7002KB Datasheet(HTML) 2 Page - Silikron Semiconductor Co.,LTD. |
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2 / 7 page ![]() 2N7002KB ©Silikron Semiconductor CO., LTD. 2012.04.20 Version: 1.0 page 2 of 7 www.silikron.com Electrical Characterizes @T A=25℃ unless otherwise specified Symbol Parameter Min. Typ. Max. Units Conditions V(BR)DSS Drain-to-Source breakdown voltage 60 — — V VGS = 0V, ID = 250μA RDS(on) Static Drain-to-Source on-resistance — 1.5 2 Ω VGS=10V, ID=0.5A — — 3 VGS=5V, ID=0.05A VGS(th) Gate threshold voltage 1 — 2.5 V VDS = VGS, ID = 250μA IDSS Drain-to-Source leakage current — — 1 μA VDS = 60V,VGS = 0V IGSS Gate-to-Source forward leakage — — ±100 nA VGS=±5V,VDS=0V — — ±10 uA VGS=±20V,VDS=0V td(on) Turn-on delay time — — 25 ns VGS=10V, VDS=30V, ID=0.2A,RGEN=10Ω td(off) Turn-Off delay time — — 35 Ciss Input capacitance — 40 — pF VGS = 0V VDS = 25V ƒ = 1MHz Coss Output capacitance — 16.6 — Crss Reverse transfer capacitance — 9.5 — Source-Drain Ratings and Characteristics Symbol Parameter Min. Typ. Max. Units Conditions IS Continuous Source Current (Body Diode) — — 0.3 A MOSFET symbol showing the integral reverse p-n junction diode. ISM Pulsed Source Current (Body Diode) — — 1.2 A V SD Diode Forward Voltage — — 1.3 V IS=0.2A, VGS=0V |
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