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EVAL-ADF4113EBZ2 Datasheet(PDF) 28 Page - Analog Devices

Part # EVAL-ADF4113EBZ2
Description  RF PLL Frequency Synthesizers
PDF  28 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

EVAL-ADF4113EBZ2 Datasheet(HTML) 28 Page - Analog Devices

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ADF4110/ADF4111/ADF4112/ADF4113
Data Sheet
Rev. F | Page 28 of 28
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option2
ADF4110BCPZ
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4110BCPZ-RL
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4110BCPZ-RL7
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4110BRU
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4110BRU-REEL
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4110BRU-REEL7
-40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4110BRUZ
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4110BRUZ-RL
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4110BRUZ-RL7
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4111BCPZ
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4111BCPZ-RL
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4111BCPZ-RL7
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4111BRU
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4111BRUZ
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4111BRUZ-RL
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4111BRUZ-RL7
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4112BCPZ
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4112BCPZ-RL
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4112BCPZ-RL7
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4112BRU
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4112BRU-REEL7
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4112BRUZ
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4112BRUZ-REEL
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4112BRUZ-REEL7
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4113BCPZ
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4113BCPZ-RL
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4113BCPZ-RL7
–40°C to +85°C
20-Lead Frame Chip Scale Package [LFCSP_WQ]
CP-20-6
ADF4113BRU
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4113BRU-REEL7
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4113BRUZ
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4113BRUZ-REEL
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4113BRUZ-REEL7
–40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADF4113BCHIPS
–40°C to +85°C
DIE
EVAL-ADF4113EBZ1
Evaluation Board
EVAL-ADF4113EBZ2
Evaluation Board
EV-ADF411XSD1Z
Evaluation Board
1
Z = RoHS Compliant Part.
2
CP-20-6 package was formerly CP-20-1 package.
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03496-0-1/13(F)



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