NE5820M53

R09DS0005EJ0200 Rev.2.00

Page 6 of 6

May 20, 2011

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Soldering Conditions

Condition Symbol

Infrared Reflow

Peak temperature (package surface temperature) : 260

°C or below

Time at peak temperature

: 10 seconds or less

Time at temperature of 220

°C or higher

: 60 seconds or less

Preheating time at 120 to 180

°C

: 120

±30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

IR260

Wave Soldering

Peak temperature (molten solder temperature)

: 260

°C or below

Time at peak temperature

: 10 seconds or less

Preheating temperature (package surface temperature) : 120

°C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

WS260

Partial Heating

Peak temperature (terminal temperature)

: 350

°C or below

Soldering time (per side of device)

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

HS350

CAUTION

Do not use different soldering methods together (except for partial heating).