AN2348

Packing specifications and labeling description

Doc ID 12282 Rev 5

5/17

The cavities in the carrier tape have been designed to avoid any damage to the

components. Specific hole is present to improve device stability during sealing and pick up

The embossed carrier tape is in a black conductive material (surface resistivity within

10E5 and 10E11 ohm/sq). Use of this material protects the component against damage

from electrostatic discharge and ensures the total discharge of the component prior to

placement on the PCB. Conductivity is guaranteed to be constant and not affected by shelf

life or humidity. The material will not break when bent and does not have any residue to rub

off, powder, or flake.

3.2

Cover tape

The carrier tape is sealed with a transparent, antistatic (surface resistivity within

10E5 ohm/sq and 10E11 ohm/sq) polyester film cover tape with a heat activated adhesive.

The cover tape tensile strength is higher than 10 N.

The peeling force of the cover tape is between 0.08 N and 0.5 N in accordance with the

testing method EIA-481-D and IEC 60286-3. Cover tape is peeled back in the direction

opposite to the carrier tape travel; the angle between the cover tape and the carrier tape is

between 165 and 180 degrees and the test is done at a speed of 120 ± 10% mm/minute.

Table 1.

Tape cavity sizing

Dimension

Die with both sides

smaller than or equal to 1.5 mm

Die with one side larger than 1.5 mm

A0 and B0

Die side size + 70 µm

Cavity dimensions established to ensure that

component rotation cannot exceed 10° max.