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AN3213 Datasheet(PDF) 42 Page - STMicroelectronics |
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AN3213 Datasheet(HTML) 42 Page - STMicroelectronics |
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42 / 64 page ![]() ST7570 demonstration board description AN3213 42/64 Doc ID 17429 Rev 1 Another important parameter for effective heat dissipation is the copper thickness for both top and bottom layers. 1 oz copper is considered as the minimum value to ensure good dissipation. The bottom-side routing plays an important role too. The solid ground area of copper under the device must be as large as possible to minimize the thermal impedance. Therefore, traces on the bottom-side must run as far as possible from the device area. 7.3.2 Ground connections Good soldering of the ST7570 exposed pad is also required to minimize ground noise. Being the exposed pad connected to VSSA, its cleanliness is directly related to the noise level detected by the receiving circuitry (i.e. to the actual sensitivity level) and to the PLL behavior. It is very important to filter each supply to its respective ground: VCC to VSS, VCCA and VDD_PLL to VSSA, VDDIO and VDD to GND. 7.3.3 Oscillator It is very important to keep the crystal oscillator and the load capacitors as close as possible to the device. The resonant circuit must be far away from noise sources such as: ● Power supply circuitry ● Burst and surge protections ● Mains coupling circuits ● Any PCB track or via carrying an RF switching signal. To properly shield and separate the oscillator section from the rest of the board, it is recommended to use a ground plane, on both sides of the PCB, filling all the area below the crystal oscillator. No tracks or vias, except for the crystal connections, should cross the ground plane. Figure 36. PCB copper dissipating area on top layer for the ST7570 demonstration board Figure 37. PCB copper dissipating area on bottom layer for the ST7570 demonstration board |
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