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AN4213 Datasheet(PDF) 14 Page - STMicroelectronics |
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AN4213 Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 42 page ![]() Designing a TM PFC AN4213 14/42 DocID023984 Rev 2 where, as given in Equation 8: The switching losses in the Power MOSFET occur only at turn-off because of TM operation and can be expressed by: Equation 22 This equation represents the crossing between the Power MOSFET current that decreases linearly during the fall time and the voltage on the Power MOSFET drain that increases. In fact during the fall time the current of the boost inductor flows into the parasitic capacitance of the Power MOSFET, charging it. For this reason switching losses depend on the total drain capacitance. At turn-on the losses are due to the discharge of the total drain capacitance inside the Power MOSFET itself. The capacitive losses are given by: Equation 23 Where C d is the total drain capacitance and V MOS is the drain voltage at Power MOSFET turn-on. Based on the above considerations, the Power MOSFET device selected is the STL13N60M2. This device is an N-channel Power MOSFET developed using a new generation of MDmesh II Plus TM low Q g . This revolutionary Power MOSFET associates a vertical structure to the company's strip layout to yield one of the world's lowest on- resistance and gate charge. This choice is confirmed by the good electrical performance and thermal behavior. 3.3.6 Boost diode selection A fast-recovery boost diode is used. The value of its DC and RMS current (see Equation 9), useful for the calculation of the losses, are both: Equation 24 The conduction losses can be estimated as follows: Equation 25 Where, V th (threshold voltage) and R d (differential resistance) are parameters of the diode. OUT AC Lpk SWrms V V I I min * 9 2 4 6 1 π − = () () Lrms SW g Lrms OUT gd AC switch I f I I V Q V P 2 * * = () () AC SW MOS d AC CAP V f V C V P * * 2 1 2 = A I I OUT D 29 . 0 = = 2 * * DRMS d D th DON I R I V P + = |
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