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AN3232 Datasheet(PDF) 5 Page - STMicroelectronics

Part # AN3232
Description  Mounting recommendations
PDF  26 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN3232 Datasheet(HTML) 5 Page - STMicroelectronics

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AN3232
Epoxy sealed, non-hermetic RF power packages
Doc ID 17594 Rev 3
5/26
1
Epoxy sealed, non-hermetic RF power packages
Epoxy sealed products, such as the STAC package family, should be received in an N2-
backfilled, vacuum-sealed ESD bag containing a desiccant. This decreases the possibility of
moisture uptake by the package materials during transit and long-term storage. STAC
packages carry a moisture sensitivity rating of 3 (MSL3), but have demonstrated capabilities
of up to MSL1.
Even with such shipping methods, it is advised to store epoxy sealed packages in the
original containers, or in a dry box, until required for soldering. When the environmental
history of devices is not well-known, such as after a prolonged storage period, it is a well-
practiced safety measure to bake non-hermetic packages for 24 hrs at 125 °C prior to
soldering operations. These conditions can be accelerated or lengthened as a function of
temperature, up to the limits imposed by shipping containers, by trays, or by device
maximum ratings. Refer to Figure 2 for recommended baking conditions.
Figure 2.
Drying times
Under no circumstances should any epoxy-sealed package be treated as a hermetically
sealed package, due to the fact that such sealing materials are not impervious to moisture
ingress. However, it is important to point out that RF Power packages are typically
constructed using engineering ceramics and polymers which, on their own, demonstrate
high resistance to moisture penetration, such as the proprietary liquid crystal polymer
materials upon which STAC packages are realized.



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