B3L30LP_15 datasheet(2/5 Pages) DIODES

2 / 5 page

B3L30LP

Document number: DS30915 Rev. 11 - 2

2 of 5

www.diodes.com

March 2014

B3L30LP

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitance load, derate current by 20%.

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

RMS Reverse Voltage

VR(RMS)

Average Rectified Output Current

3.0

Non-Repetitive Peak Forward Surge Current

8.3ms Single half sine-wave Superimposed on Rated Load

IFSM

Thermal Characteristics

Characteristic

Symbol

Typ

Max

Unit

Thermal Resistance Junction to Soldering Point

RθJS

⎯

°C/W

Thermal Resistance Junction to Ambient Air

(Note 5)

RθJA

130

⎯

°C/W

Power Dissipation

(Note 6)

(Note 7)

(Note 8)

⎯

2.5

4.0

4.5

Operating and Storage Temperature Range

TJ, TSTG

-65 to +150

°C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 9)

V(BR)R

⎯

IR = 5.0mA

Forward Voltage

⎯

0.28

⎯

IF = 0.5A, TJ = +25°C

⎯

0.30

0.35

IF = 1.0A, TJ = +25°C

⎯

0.18

0.29

IF = 1.0A, TJ = +125°C

⎯

0.33

0.40

IF = 2.0A, TJ = +25°C

⎯

0.22

0.37

IF = 2.0A, TJ = +125°C

⎯

0.35

0.45

IF = 3.0A, TJ = +25°C

⎯

0.26

0.42

IF = 3.0A, TJ = +125°C

Reverse Current (Note 9)

⎯

0.27

1.0

TJ = +25°C, VR = 30V

⎯

TJ = +100°C, VR = 30V

Notes:

5. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com. TA = +25°C.

6. Device mounted on FR-4 PCB, 25mm

2 pad area.

7. Device mounted on FR-4 PCB, 75mm

2 pad area.

8. Aluminum PCB with copper mounting pad area of 75mm

9. Short duration pulse test used to minimize self-heating effect.

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