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LTM4627

4627fc

For more information www.linear.com/LTM4627

APPLICATIONS INFORMATION

Safety Considerations

The LTM4627 modules do not provide isolation from VIN

to VOUT. There is no internal fuse. If required, a slow blow

fuse with a rating twice the maximum input current needs

to be provided to protect each unit from catastrophic

failure. The device does support overvoltage protection

and overcurrent protection.

Layout Checklist/Example

The high integration of the LTM4627 makes the PCB

board layout very simple and easy. However, to optimize

its electrical and thermal performance, some layout con-

siderations are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, GND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on the pad, unless they are

capped or plated over.

• Place test points on signal pins for testing.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

• For parallel modules, tie the COMP and VFB pins to-

gether. Use an internal layer to closely connect these

pins together.

Figure 17 gives a good example of the recommended

layout. LGA and BGA PCB layouts are identical with the

exceptionofcirclepadsforBGA(seePackageDescription).

Figure 17. Recommended PCB Layout

(LGA Shown, for BGA Use Circle Pads)

GND

VIN

4627 F17

CONTROL

SIGNAL

GROUND

VOUT

COUT

CIN

LTM4627 Datasheet(PDF) 23 Page - Linear Technology

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