IRF6723M2DPBF_15 datasheet(3/10 Pages) IRF

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IRF6723M2DTR/TR1PbF

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Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

Surface mounted on 1 in. square Cu board, steady state.

TC measured with thermocouple incontact with top (Drain) of part.

Used double sided cooling, mounting pad with large heatsink.

Notes:

Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.

Rθ is measured at TJ of approximately 90°C.

Surface mounted on 1 in. square Cu

board (still air).

Mounted on minimum footprint full size board with metalized

back and with small clip heatsink. (still air)

1E-006

1E-005

0.0001

0.001

0.01

0.1

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

Ri (°C/W)

τi (sec)

3.1440

0.000878

23.201

0.291662

19.855

1.970485

9.7220

0.027200

τJ

τ1

τ2

τ3

Ci=

τi/Ri

Ci=

τi/Ri

τA

τ4

Absolute Maximum Ratings (each die operating consecutively)

Parameter

Units

PD @TA = 25°C

Power Dissipation

PD @TA = 70°C

Power Dissipation

PD @TC = 25°C

Power Dissipation

Peak Soldering Temperature

°C

Operating Junction and

TSTG

Storage Temperature Range

Thermal Resistance (each die operating consecutively)

Parameter

Typ.

Max.

Units

RθJA

Junction-to-Ambient

–––

RθJA

Junction-to-Ambient

12.5

–––

RθJA

Junction-to-Ambient

–––

°C/W

RθJC

Junction-to-Case

–––

5.9

RθJ-PCB

Junction-to-PCB Mounted

1.0

–––

Linear Derating Factor

eÃ

W/°C

0.018

270

-55 to + 175

Max.

2.7

1.9

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