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LP3878SD-ADJ/NOPB Datasheet(PDF) 2 Page - Texas Instruments |
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LP3878SD-ADJ/NOPB Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 25 page ![]() LP3878-ADJ SNVS311D – MAY 2005 – REVISED FEBRUARY 2015 www.ti.com Table of Contents 7.4 Device Functional Modes........................................ 12 1 Features .................................................................. 1 8 Application and Implementation ........................ 13 2 Applications ........................................................... 1 8.1 Application Information............................................ 13 3 Description ............................................................. 1 8.2 Typical Application ................................................. 13 4 Revision History..................................................... 2 9 Power Supply Recommendations ...................... 17 5 Pin Configuration and Functions ......................... 3 10 Layout................................................................... 17 6 Specifications......................................................... 4 10.1 Layout Guidelines ................................................. 17 6.1 Absolute Maximum Ratings ...................................... 4 10.2 Layout Example .................................................... 17 6.2 ESD Ratings.............................................................. 4 10.3 Power Dissipation ................................................. 17 6.3 Recommended Operating Conditions ....................... 4 11 Device and Documentation Support ................. 18 6.4 Thermal Information .................................................. 4 11.1 Documentation Support ........................................ 18 6.5 Electrical Characteristics........................................... 5 11.2 Trademarks ........................................................... 18 6.6 Typical Characteristics .............................................. 6 11.3 Electrostatic Discharge Caution ............................ 18 7 Detailed Description ............................................ 11 11.4 Glossary ................................................................ 18 7.1 Overview ................................................................. 11 12 Mechanical, Packaging, and Orderable 7.2 Functional Block Diagram ....................................... 11 Information ........................................................... 18 7.3 Feature Description................................................. 11 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (December 2014) to Revision D Page • Deleted trademark symbol from VIP - no longer trademark; add reference design icon to Top Navigators.......................... 1 • Deleted soldering info - now in POA ..................................................................................................................................... 4 • Changed wording of footnote 5 to Ab Max Ratings ............................................................................................................... 4 • Changed IOUT to IOUT throughout document............................................................................................................................ 5 • Changed wording of Reverse Input-Output Voltage ............................................................................................................ 11 • Changed outpin pin to OUT pin ........................................................................................................................................... 15 • Added new paragraph to Noise Bypass Capacitor subsection ........................................................................................... 15 Changes from Revision B (April 2013) to Revision C Page • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; update thermal values ....................................................................................................................................................................... 1 Changes from Revision A (April 2013) to Revision B Page • Changed layout of National Data Sheet to TI format ........................................................................................................... 16 2 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated Product Folder Links: LP3878-ADJ |
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