LM20136MHSLASHNOPB datasheet(3/32 Pages) TI

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LM20136

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SNVS564B – JANUARY 2009 – REVISED APRIL 2013

Absolute Maximum Ratings

(1) (2)

Voltages from the indicated pins to GND

AVIN, PVIN, EN, PGOOD, SS/TRK, COMP, FB, SW, SYNC

-0.3V to +6V

Storage Temperature

-65°C to 150°C

Junction Temperature

150°C

Power Dissipation(3)

2.6W

Lead Temperature (Soldering, 10 sec)

260°C

Minimum ESD Rating(4)

±2kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ_MAX, the junctions-to-ambient thermal

resistance,

θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using: PD_MAX = (TJ_MAX – TA)/θJA. The maximum power dissipations of 2.6W is determined using TA = 25°C, θJA = 25°C/W, and TJ_MAX

= 125°C. The

θJA specification of 25°C/W listed in the electrical characteristics table is measured with the part surface mounted to a 2" x

2" FR4 4 layer board. See Figure 37 for more detailed

θJA information.

(4)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor to each pin.

Operating Ratings

PVIN, AVIN to GND

2.95V to 5.5V

Junction Temperature

−40°C to + 125°C

Electrical Characteristics

Unless otherwise stated, the following conditions apply: AVIN = PVIN = VIN = 5V. Limits in standard type are for TJ = 25°C

only, limits in bold face type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits

are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at

TJ = 25°C, and are provided for reference purposes only.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VFB

Feedback pin voltage

VIN = 2.95V to 5.5V

0.788

0.8

0.812

ΔVOUT/ΔIOUT

Load Regulation

IOUT = 100 mA to 6A

0.04

%/A

ICL

Switch Current Limit Threshold

VIN = 3.3V

7.65

8.5

9.35

RDS_ON

High-Side Switch On Resistance

ISW = 3.5A

Ω

RDS_ON

Low-Side Switch On Resistance

ISW = 3.5A

Ω

Operating Quiescent Current

Non-switching, VFB = VCOMP

3.5

ISD

Shutdown Quiescent current

VEN = 0V

180

µA

VUVLO

VIN Under Voltage Lockout

Rising VIN

2.45

2.7

2.95

VUVLO_HYS

VIN Under Voltage Lockout Hysteresis

Falling VIN

100

VVCC

VCC Voltage

IVCC = 0 µA

2.45

2.7

2.95

ISS

Soft-Start Pin Source Current

VSS/TRK = 0V

4.5

µA

VTRACK

SS/TRK Accuracy, VSS - VFB

VSS/TRK = 0.4V

-10

Oscillator and Clock Synchronization

FOSC

Oscillator Frequency

VSYNC = Static

360

410

460

kHz

FOSCH

Maximum SYNC Frequency

1500

kHz

FOSCL

Minimum SYNC Frequency

460

kHz

VIH_SYNC

SYNC pin Logic High

VIL_SYNC

SYNC pin Logic Low

0.8

ISYNC

SYNC pin input leakage

VSYNC = 5V

DCMAX

Maximum Duty Cycle

ILOAD = 0A

TON_TIME

Minimum On Time

100

TCL_BLANK

Current Sense Blanking Time

After Rising VSW

Error Amplifier and Modulator

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