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BCM856DS/DG Datasheet(PDF) 10 Page - NXP Semiconductors |
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BCM856DS/DG Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 14 page  BCM856BS_BCM856DS_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 7 August 2008 10 of 14 NXP Semiconductors BCM856BS; BCM856DS PNP/PNP matched double transistors Fig 14. Wave soldering footprint SOT363 (SC-88) Fig 15. Reflow soldering footprint SOT457 (SC-74) sot363_fw solder lands solder resist occupied area preferred transport direction during soldering 5.3 1.3 1.3 1.5 0.3 1.5 4.5 2.45 2.5 Dimensions in mm solder lands solder resist occupied area solder paste sot457_fr 3.45 1.95 2.825 3.3 0.45 (6 ×) 0.55 (6 ×) 0.7 (6 ×) 0.8 (6 ×) 2.4 0.95 0.95 Dimensions in mm |
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