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NVMFS6B03NL Datasheet(PDF) 5 Page - ON Semiconductor |
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NVMFS6B03NL Datasheet(HTML) 5 Page - ON Semiconductor |
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5 / 6 page ![]() NVMFS6B03NL www.onsemi.com 5 TYPICAL CHARACTERISTICS Figure 12. GFS vs. ID ID, DRAIN CURRENT (A) 120 80 20 0 0 20 60 80 100 140 PULSE TIME (sec) 0.01 0.001 10 1 0.0001 0.00001 0.1 0.000001 0.001 0.01 0.1 1 10 100 100 1000 50% Duty Cycle 20% 10% 5% 2% 1% Single Pulse NTMFS6B03NL, 650 mm2, 2 oz, Cu Single Layer Pad Figure 13. IPEAK vs. TAV TAV, TIME IN AVALANCHE (sec) 10E−3 1E−3 100E−6 1 10 100 Figure 14. Thermal Response 40 60 100 140 40 120 100 °C 25 °C DEVICE ORDERING INFORMATION Device Marking Package Shipping† NVMFS6B03NLT1G 6B03NL DFN5 (Pb−Free) 1500 / Tape & Reel NVMFS6B03NLWFT1G 6B03WF DFN5 (Pb−Free, Wettable Flanks) 1500 / Tape & Reel NVMFS6B03NLT3G 6B03 DFN5 (Pb−Free) 5000 / Tape & Reel NVMFS6B03NLWFT3G 6B03WF DFN5 (Pb−Free, Wettable Flanks) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
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