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NVMFS6B03NL Datasheet(PDF) 2 Page - ON Semiconductor |
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NVMFS6B03NL Datasheet(HTML) 2 Page - ON Semiconductor |
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2 / 6 page ![]() NVMFS6B03NL www.onsemi.com 2 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 100 V Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ 67.3 mV/ °C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 80 V TJ = 25°C 10 mA TJ = 125°C 100 Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = 16 V 100 nA ON CHARACTERISTICS (Note 4) Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250 mA 1.0 3.0 V Negative Threshold Temperature Coefficient VGS(TH)/TJ −8.1 mV/ °C Drain−to−Source On Resistance RDS(on) VGS = 10 V ID = 20 A 3.8 4.8 m W CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance CISS VGS = 0 V, f = 1 MHz, VDS = 50 V 4200 pF Output Capacitance COSS 760 Reverse Transfer Capacitance CRSS 31 Total Gate Charge QG(TOT) VGS = 10 V, VDS = 80 V; ID = 50 A 58 nC Threshold Gate Charge QG(TH) 6.2 Gate−to−Source Charge QGS 19 Gate−to−Drain Charge QGD 17 Plateau Voltage VGP 5.4 V Gate Resistance RG TJ = 25°C 1.0 W SWITCHING CHARACTERISTICS (Note 5) Turn−On Delay Time td(ON) VGS = 4.5 V, VDS = 80 V, ID = 50 A, RG = 1.0 W 16 ns Rise Time tr 46 Turn−Off Delay Time td(OFF) 29 Fall Time tf 11 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD VGS = 0 V, IS = 50 A TJ = 25°C 0.9 1.2 V TJ = 125°C 0.8 Reverse Recovery Time tRR VGS = 0 V, dIS/dt = 100 A/ms, IS = 25 A 67 ns Charge Time ta 35 Discharge Time tb 31 Reverse Recovery Charge QRR 120 nC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 5. Switching characteristics are independent of operating junction temperatures. |
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