DLP5500

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DLPS013F – APRIL 2010 – REVISED MAY 2015

Revision History (continued)

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Added Window Characteristics section ............................................................................................................................... 18

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Added Chipset Component Usage Specification section .................................................................................................... 18

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Changed Micromirror Array, Pitch, Hinge Axis Orientation Figure to generic image (M x N) .............................................. 22

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Changed Micromirror States: On, Off, Flat Figure to generic DMD image .......................................................................... 23

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Changed Test Point locations from TC1 & TC2 to TP1 - TP5 ............................................................................................. 25

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Changed Test Point location Diagram to show TP1 - TP5................................................................................................... 26

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Added Micromirror Landed-on/Landed-Off Duty Cycle section ............................................................................................ 27

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Changed Typical Application diagram .................................................................................................................................. 30

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Replaced "DAD" with "DLPA200" ......................................................................................................................................... 31

Changes from Revision D (October 2012) to Revision E

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Deleted the Device Part Number Nomenclature section...................................................................................................... 34

Changes from Revision C (June 2012) to Revision D

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Changed the Device Part Number Nomenclature From: DLP5500FYA To: DLP5500AFYA............................................... 34

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Updated Mechanical ICD to V2 with a minor change in the window height......................................................................... 34

Changes from Revision B (Spetember 2011) to Revision C

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Added the Package Footprint and Socket information in the Features list ........................................................................... 1

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Deleted redundant information from the Description .............................................................................................................. 1

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Changed the Illumination power density Max value of <420 mm From: 20 To: 2 mW/cm

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Changed Storage temperature range and humidity values in Absolute Maximum Ratings .................................................. 7

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Added Operating Case Temperature, Operating Humidity, Operating Device Temperature Gradient and Operating

Landed Duty-Cycle to RECOMMENDED OPERATING CONDITIONS. ................................................................................ 8

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Added Mirror metal specular reflectivity and Illumination overfill values to "Micromirror Array Optical Characteristics"

table ...................................................................................................................................................................................... 17

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Corrected the document reference in Related Documents section...................................................................................... 34

Changes from Revision A (June 2010) to Revision B

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Changed the window refractive index NOM spec From: 1.5090 To: 1.5119 ....................................................................... 17

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Added table note "At a wavelength of 632.8 nm"................................................................................................................. 17

Changes from Original (April 2010) to Revision A

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Clarified Note6 measurement point ....................................................................................................................................... 7

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Changed the Illumination power density Max value of <420 mm From: 2 To: 20 mW/cm

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Added Additional Related Documents.................................................................................................................................. 34

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