DLP5500AFYA datasheet(7/46 Pages) TI1

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DLP5500

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DLPS013F – APRIL 2010 – REVISED MAY 2015

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

ELECTRICAL

VCC

Voltage applied to VCC

(2) (3)

–0.5

VCCI

Voltage applied to VCCI

(2) (3)

–0.5

Delta supply voltage |VCC – VCCI|

(4)

0.3

Maximum differential voltage, Damage can occur to internal resistor if exceeded,

|VID|

700

See Figure 6

VCC2

Voltage applied to VOFFSET

(2) (3) (4)

–0.5

VMBRST

Voltage applied to MBRST[0:15] Input Pins

–28

Voltage applied to all other pins(2)

–0.5

VCC + 0.3

Current required from a high-level

IOH

VOH = 2.4 V

–20

output

Current required from a low-level

IOL

VOL = 0.4 V

output

ENVIRONMENTAL

Case temperature: operational (5) (6)

–20

ºC

TCASE

Case temperature: non–operational (6)

–40

ºC

Dew Point (Operating and non-Operating)

ºC

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages referenced to VSS (ground).

(3)

Voltages VCC, VCCI, and VCC2 are required for proper DMD operation.

(4)

Exceeding the recommended allowable absolute voltage difference between VCC and VCCI may result in excess current draw. The

difference between VCC and VCCI, | VCC - VCCI|, should be less than .3V.

(5)

Exposure of the DMD simultaneously to any combination of the maximum operating conditions for case temperature, differential

temperature, or illumination power density (see Recommended Operating Conditions).

(6)

DMD Temperature is the worst-case of any test point shown in Figure 15, or the active array as calculated by the Micromirror Array

Temperature Calculation.

8.2 Storage Conditions

applicable before the DMD is installed in the final product

MIN

MAX

UNIT

Tstg

DMD storage temperature

–40

°C

Storage Dew Point - long-term (1)

TDP

Storage dew point

°C

Storage Dew Point - short-term (2)

(1)

Long-term is defined as the usable life of the device.

(2)

Dew points beyond the specified long-term dew point are for short-term conditions only, where short-term is defined as less than 60

cumulative days over the usable life of the device (operating, non-operating, or storage).

8.3 ESD Ratings

VALUE

UNIT

Electrostatic discharge immunity for LVCMOS [I/O] pins(1)

±2000

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all other

±2000

V(ESD)

Electrostatic discharge

pins [power, control pins] except MBRST (2)

Electrostatic discharge immunity for MBRST[0:15] pins(1)

<250

(1)

Tested in accordance with JESD22-A114-B Electrostatic Discharge (ESD) sensitivity testing Human Body Model (HBM).

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

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