L6362A

Protection and diagnostic

DocID027660 Rev 4

27/37

11

Protection and diagnostic

The IC integrates several protections to ease the design of a robust application. Protection

functions are intended to avoid IC damage in fault conditions and are not intended for

continuous operation. Continuous and repetitive operations of protection functions may

reduce the IC lifetime.

Table 19: Diagnostic truth table

Operation

DIAG

OL

HS

configuration

(OUTL not

connected)

LS configuration

(OUTH not

connected)

PP (OUTH wired

to OUTL)

During DT

1

1

High Z slow

demagnetization,

Cut-off

0

1

Off (active

clamp)(1)

Off (active clamp)

High Z slow

demagnetization,

Current limitation

1

0

Linearly

controlled

Linearly

controlled

Linearly controlled

UVLO(2)

0

Not

controlled

Off (active clamp)

Off (active clamp)

High Z active

clamp

Overtemperature

0

1

Off (active clamp)

Off (active clamp)

High Z slow

demagnetization,

Notes:

OUTL are wired together, slow demagnetization is used only in case of overtemperature protection intervention.

11.1

Undervoltage lock-out

The output stage, the receiver and several internal circuitries turn off as the supply voltage

"Supply".

11.2

Overtemperature

temperature see Table 11: "Electrical characteristics, logic inputs (IN1, IN2, EN/DIAG, SEL)

11.3

Current limitation and cut-off

The output current of the power stage is internally limited to a safe value, see Table 11:

"Electrical characteristics, logic inputs (IN1, IN2, EN/DIAG, SEL) ".

delay, see Table 11: "Electrical characteristics, logic inputs (IN1, IN2, EN/DIAG, SEL) ",

Please notice that the power dissipated by the IC can be significantly high in current

limitation condition.