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STL33N60M2 Datasheet(PDF) 3 Page - STMicroelectronics |
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STL33N60M2 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 15 page ![]() STL33N60M2 Electrical ratings DocID024325 Rev 3 3/15 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ± 25 V ID (1) Drain current (continuous) at TC = 25 °C 22 A ID (1) Drain current (continuous) at TC = 100 °C 13.8 A IDM (2) Drain current (pulsed) 88 A PTOT Total dissipation at TC = 25 °C 150 W IAR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) 4 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 1100 mJ dv/dt (3) Peak diode recovery voltage slope 15 V/ns dv/dt (4) MOSFET dv/dt ruggedness 50 V/ns Tstg Storage temperature - 55 to 150 °C Tj Operating junction temperature 150 °C Notes: (1) The value is limited by package. (2) Pulse width limited by safe operating area. (3) ISD ≤ 22 A, di/dt ≤ 400 A/µs, VDS(peak) < V(BR)DSS, VDD = 400 V. (4) VDS ≤ 480 V. Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 0.83 °C/W Rthj-amb (1) Thermal resistance junction-ambient max 45 °C/W Notes: (1) When mounted on FR-4 board of inch², 2oz Cu. |
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