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GS6151 Datasheet(PDF) 75 Page - Semtech Corporation |
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GS6151 Datasheet(HTML) 75 Page - Semtech Corporation |
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75 / 77 page ![]() GS6151 Final Data Sheet Rev.4 PDS-060389 August 2015 75 of 77 Semtech Proprietary & Confidential www.semtech.com 7.2 Recommended PCB Footprint Figure 7-2: GS6151 PCB Footprint 7.3 Packaging Data CENTER PAD 2.75 2.75 3.90 3.90 0.20 0.55 0.40 Note: All dimensions in millimeters Table 7-1: Packaging Data Parameter Value Package Type 32-pin QFN / 4mm x 4mm / 0.4mm pad pitch Moisture Sensitivity Level (Note 1)3 Junction to Case Thermal Resistance, θ j-c 29.8°C/W Junction to Air Thermal Resistance, θ j-a 35.4°C/W Junction to Board Thermal Resistance, θ j-b 12.0°C/W Psi, Ψ 0.3°C/W Pb-free and RoHS Compliant Yes Note: 1. Value per JEDEC J-STD-020C |
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