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BCM4390 Datasheet(PDF) 9 Page - Cypress Semiconductor

Part # BCM4390
Description  WICED??Wi-Fi IEEE 802.11 b/g/n SoC with Embedded Application Processor
PDF  78 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

BCM4390 Datasheet(HTML) 9 Page - Cypress Semiconductor

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List of Tables
BCM4390 Advance Data Sheet
BROADCOM
WICED Wi-Fi IEEE 802.11 SoC w/Embedded App Processor
February 5, 2014 • 4390-DS103-R
Page 8
®
BROADCOM CONFIDENTIAL
List of Tables
Table 1: Power-Up/Power-Down/Reset Control Signals..................................................................................16
Table 2: Crystal Oscillator and External Clock – Requirements and Performance ...........................................18
Table 3: External 32.768 kHz Sleep Clock Specifications..................................................................................20
Table 4: GPIO Port A Alternate Functions ........................................................................................................23
Table 5: Example of Common Baud Rates........................................................................................................24
Table 6: UART Timing Specifications ................................................................................................................25
Table 7: Bank B GPIO Test Functions................................................................................................................26
Table 8: 286-Bump WLCSP Coordinates...........................................................................................................39
Table 9: WLCSP and FCFBGA Pin Descriptions ................................................................................................47
Table 10: I/O States ..........................................................................................................................................52
Table 11: Absolute Maximum Ratings..............................................................................................................55
Table 12: Environmental Ratings......................................................................................................................56
Table 13: ESD Specifications.............................................................................................................................56
Table 14: Recommended Operating Conditions and DC Characteristics .........................................................57
Table 15: 2.4 GHz Band General RF Specifications...........................................................................................59
Table 16: WLAN 2.4 GHz Receiver Performance Specifications .......................................................................59
Table 17: WLAN 2.4 GHz Transmitter Performance Specifications..................................................................62
Table 18: General Spurious Emissions Specifications.......................................................................................63
Table 19: Core Buck Switching Regulator (CBUCK) Specifications ...................................................................64
Table 20: LDO3P3 Specifications ......................................................................................................................65
Table 21: CLDO Specifications ..........................................................................................................................66
Table 22: LNLDO Specifications ........................................................................................................................67
Table 23: Application Processor Current Consumption ...................................................................................68
Table 24: Typical WLAN Power Consumption ..................................................................................................68
Table 25: JTAG Timing Characteristics..............................................................................................................69
Table 26: Package Thermal Characteristics ......................................................................................................73



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