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DMN3067LW Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMN3067LW
Description  Low On-Resistance
PDF  6 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN3067LW Datasheet(HTML) 2 Page - Diodes Incorporated

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DMN3067LW
Document number: DS36640 Rev. 4 - 2
2 of 6
www.diodes.com
March 2014
© Diodes Incorporated
DMN3067LW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±12
V
Continuous Drain Current (Note 6) VGS = 4.5V
Steady
State
TA = +25°C
TA = +70°C
ID
2.6
2.1
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IDM
10
A
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation
(Note 5)
PD
0.5
W
(Note 6)
1.1
Thermal Resistance, Junction to Ambient
(Note 5)
RθJA
241
°C/W
(Note 6)
130
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
30
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current
IDSS
1
µA
VDS = 30V, VGS = 0V
Gate-Body Leakage
IGSS
±10
μA
VGS = ±12V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(th)
0.5
1.5
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS (ON)
48
67
mΩ
VGS = 4.5V, ID = 2.5A

50
70
VGS = 4.0V, ID = 2.5A

70
98
VGS = 2.5V, ID = 2.5A
Diode Forward Voltage
VSD

1.2
V
VGS = 0V, IS = 0.6A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
447
pF
VDS = 10V, VGS = 0V, f = 1.0MHz
Output Capacitance
Coss
54
Reverse Transfer Capacitance
Crss
41
Gate Resistance
RG

23

Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
Total Gate Charge
Qg
4.6
nC
VGS = 4.5V, VDS = 15V,
ID = 2.5A
Gate-Source Charge
Qgs
1.0
Gate-Drain Charge
Qgd
1.0
Turn-On Delay Time
tD(on)
3.8
nS
VDD = 15V, ID = 1.25A, VGEN = 4.5V,
RGEN = 10Ω
Turn-On Rise Time
tr
5.2
Turn-Off Delay Time
tD(off)

15

Turn-Off Fall Time
tf

6.1

Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.



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