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LM3208TL/NOPB Datasheet(PDF) 12 Page - Texas Instruments |
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LM3208TL/NOPB Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 25 page ![]() MOSFET CONTROL LOGIC SW CURRENT COMP OSCILLATOR ERROR AMPLIFIER DELAY LOGIC VCON FB SHUTDOWN CONTROL MAIN CONTROL EN FET SIZE CONTROL COMP PVIN PGND VDD GND SMALL PFET LARGE PFET LM3208 SNVS404B – APRIL 2006 – REVISED MARCH 2013 www.ti.com BLOCK DIAGRAM Figure 34. Functional Block Diagram OPERATION DESCRIPTION The LM3208 is a simple, step-down DC-DC converter optimized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery powered RF devices. It is designed to allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single Li-Ion battery cell. It is based on a current-mode buck architecture, with synchronous rectification for high efficiency. It is designed for a maximum load capability of 650mA when VOUT > 1.05V (typ.) and 400mA when VOUT < 1.00V (typ.) in PWM mode. Maximum load range may vary from this depending on input voltage, output voltage and the inductor chosen. Efficiency is typically around 95% for a 400mA load with 3.4V output, 3.9V input. The LM3208 has an RDSON management scheme to increase efficiency when VOUT ≤ 1V. The output voltage is dynamically programmable from 0.8V to 3.6V by adjusting the voltage on the control pin without the need for external feedback resistors. This prolongs battery life by changing the PA supply voltage dynamically depending on its transmitting power. Additional features include current overload protection and thermal overload shutdown. The LM3208 is constructed using a chip-scale 8-pin DSBGA package. This package offers the smallest possible size, for space-critical applications such as cell phones, where board area is an important design consideration. Use of a high switching frequency (2MHz, typ.) reduces the size of external components. As shown in Figure 1, only three external power components are required for implementation. Use of a DSBGA package requires special design considerations for implementation. (See DSBGA Package Assembly and Use in the Application Information section.) Its fine bump-pitch requires careful board design and precision assembly equipment. Use of this package is best suited for opaque-case applications, where its edges are not subject to high-intensity ambient red or infrared light. In addition, the system controller should set EN low during power-up and other low supply voltage conditions. (See Shutdown Mode in the Device Information section.) 12 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM3208 |
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