LM3561

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SNOSB44C – MARCH 2011 – REVISED MAY 2013

Table 2. Pin Descriptions

Name

Pin

Description

GND

A1

Ground

IN

A2

Input Voltage Connection. Connect IN to the input supply and bypass to GND with a minimum 10µF

ceramic capacitor.

HWEN

A3

Active Low Hardware Reset Input. This input is high impedance and cannot be left floating. Typically this

would be tied to a pullup resistor and to a logic high voltage, or VIN, in order to enable the LM3561.

SW

B1

Drain Connection for Internal NMOS and Synchronous PMOS Switches

STROBE

Active High Hardware Flash Enable. Drive STROBE high to turn on the Flash pulse. STROBE has an

B2

internal 300k

Ω pulldown to GND.

SCL

B3

Serial Clock Input.

OUT

C1

Step-Up DC/DC Converter Output. Bypass OUT to GND with a 10µF Ceramic Capacitor.

TX1/TORCH/GPIO

C2

Configurable as a Flash Interrupt Input, a Hardware Torch Enable, or a Programmable General Purpose

Logic Input/Output. This pin has an internal 300k

Ω pulldown to GND.

SDA

C3

Serial Data Input/Output.

LED

D1

High Side Current Source Output for Flash LED.

Configurable as a High Side Current Source Output for Indicator LEDs or as a Threshold Detector for

LEDI/NTC

D2

LED Temperature Sensing.

Configurable as a Flash Interrupt Input, a Programmable General Purpose Logic Input/Output, or as an

TX2/GPIO2/INT

D3

Interrupt output for fault notification. This pin has an internal 300k

Ω pulldown to GND.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

-0.3V to 6V

Internally Limited

+150°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Soldering)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

(5)

For detailed soldering specifications and information, see Application Note 1112: Micro SMD Wafer Level chip Scale Package SNVA009

Operating Ratings

(1) (2)

2.5V to 5.5V

-40°C to +125°C

(3)

-40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

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