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LMH6704MA/NOPB Datasheet(PDF) 2 Page - Texas Instruments

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Part # LMH6704MA/NOPB
Description  650 MHz Selectable Gain Buffer with Disable
PDF  20 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMH6704MA/NOPB Datasheet(HTML) 2 Page - Texas Instruments

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LMH6704
SNOSAD0C – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance (2)
Human Body Model
2000V
Machine Model
200V
Supply Voltage
13.5V
IOUT
(3)
Common-Mode Input Voltage
VS
− to V
S
+
Maximum Junction Temperature
150°C
Storage Temperature Range
−65°C to 150°C
Infrared or Convection (20 sec.)
235°C
Soldering Information
Wave Soldering (10 sec.)
260°C
Lead Temp. (soldering 10 sec.)
300°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2)
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3)
The maximum output current (IOUT) is determined by device power dissipation limitations.
Operating Ratings
(1)
Nominal Supply Voltage
±4V to ±6V
Temperature Range (2)
−40°C to 85°C
Thermal Resistance
Package
(
θJC)
(
θJA)
8-Pin SOIC
75°C/W
160°C/W
6-Pin SOT23
120°C/W
187°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2)
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
2
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Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LMH6704



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