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LP3958TL/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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LP3958TL/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 36 page ![]() LP3958 SNVS423C – JANUARY 2006 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) V (SW, FB, MAIN, SUB, KEY1, KEY2, KEY3) -0.3V to +20V VDD1, VDD2, VDDIO, VDDA -0.3V to +6.0V Voltage on IKEY, IRT, VREF -0.3V to VDD1+0.3V with 6.0V max Voltage on Logic Pins -0.3V to VDDIO +0.3V with 6.0V max I (VREF) 10µA I(KEY1, KEY2, KEY3) 100mA Continuous Power Dissipation (4) Internally Limited Junction Temperature (TJ-MAX) 125ºC Storage Temperature Range -65ºC to +150ºC Maximum Lead Temperature (Soldering) (5) 260ºC ESD Rating (6) Human Body Model 2kV Machine Model 200V (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and disengages at TJ=130ºC (typ.). (5) For detailed soldering specifications and information, please refer to Application Note AN1112: DSBGA Wafer Level Chip Scale Package (6) The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Operating Ratings (1) (2) V (SW, FB, MAIN, SUB) 0 to +19V VDD1,2 3.0 to 5.5V VDDIO 1.65V to VDD1 Recommended Load Current (KEY1, KEY2, KEY3) CC Mode 0mA to 15mA/driver Recommended Total Boost Converter Load Current 0mA to 70mA Junction Temperature (TJ) -30ºC to +125ºC Ambient Temperature (TA) (3) -30ºC to +85ºC (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Thermal Properties Junction-to-Ambient Thermal Resistance( θJA) (1) 60 - 100ºC/W (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. 4 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LP3958 |
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