TLK2201RCPR datasheet(10/24 Pages) TI1

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ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATING TABLE

(1)

THERMAL CHARACTERISTICS

TLK2201

TLK2201I

ETHERNET TRANSCEIVERS

SLLS420F – JUNE 2000 – REVISED SEPTEMBER 2007

over operating free-air temperature (unless otherwise noted)

UNIT

Supply voltage, VDD

(2)

-0.3 V to 3 V

Input voltage range at TTL terminals, VI

-0.5 V to 4 V

Input voltage range at any other terminal

-0.3 V to VDD +0.3 V

Storage temperature, Tstg

-65

°C to 150°C

Electrostatic discharge

CDM: 1 kV, HBM:2 kV

TLK2201

°C to 70°C

Characterized free-air operating temperature range:

TLK2201I

-40

°C to 85°C

(1)

Stresses beyond those listed under„ absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under„ recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

TA≤ 25°C

OPERATING FACTOR(2)

TA = 70°C

PACKAGE

POWER RATING

ABOVE TA = 25°C

POWER RATING

RCP64(3)

5.25 W

46.58 mW/

°C

2.89 W

RCP64(4)

3.17 W

23.70 mW/

°C

1.74 W

RCP64(5)

2.01 W

13.19 mW/

°C

1.11 W

(1)

For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature number SLMA002.

(2)

This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA).

(3)

2 oz. Trace and copper pad with solder.

(4)

2 oz. Trace and copper pad without solder.

(5)

Standard JEDEC high-K board

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased

21.47

to thermal land

RΘJA

Junction-to-free-air thermal resistance

Board-mounted, no air flow, high conductivity TI

°C/W

recommended test board with thermal land but no

42.20

solder or grease thermal connection to thermal land

Board-mounted, no air flow, JEDEC test board

75.83

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased

0.38

to thermal land

RΘJC

Junction-to-case-thermal resistance

Board-mounted, no air flow, high conductivity TI

°C/W

recommended test board with thermal land but no

0.38

solder or grease thermal connection to thermal land

Board-mounted, no air flow, JEDEC test board

7.8

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