P89LPC932BA datasheet(58/60 Pages) PHILIPS

58 / 60 page

Philips Semiconductors

P89LPC932

8-bit microcontroller with accelerated two-clock 80C51 core

Product data

Rev. 04 — 06 January 2004

58 of 60

9397 750 12379

[3]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex

foil by using a hot bar soldering process. The appropriate soldering proﬁle can be provided on

request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Revision history

Table 13:

Revision history

Rev Date

CPCN

Description

20040106

Product data (9397 750 12379); ECN 853-2433 01-A15016 dated 16 December 2003

Modiﬁcations:

• Table 4 “Special function registers”: changed PLEEN to PLLEN.

• Section 8.27.2 “Features” on page 41: adjusted bullet for erase/program cycles

• Table 8 “DC electrical characteristics” on page 45: adjusted value for ITL VIN.

20031007

Product data (9397 750 12119); ECN 853-2433 30392 dated 30 September 2003

20030725

Product data (9397 750 11712); ECN 853-2433 30141 dated 23 July 2003.

Supersedes Preliminary data P89LPC932_1 of 21 October 2002 (9397 750 10475)

P89LPC932BA Datasheet(PDF) 58 Page - NXP Semiconductors

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