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CY7C65013
CY7C65113
Document #: 38-08002 Rev. *B
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© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Purchase of I2C components from Cypress, or one of its sublicensed Associated Companies, conveys a license under the Philips
I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification
as defined by Philips. All product and company names mentioned in this document are the trademarks of their respective holders.
25.0
Package Diagrams (continued)
51-85014-*B
28-lead (300-Mil) Molded DIP P21
51-85020-*A
48-lead (600-Mil) Molded DIP P25
28-lead (300-Mil) Molded SOIC S21
51-85026-*A
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