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AL5802LPL Datasheet(PDF) 4 Page - Diodes Incorporated

Part # AL5802LPL
Description  LED DRIVER, 30V, LINEAR, ADJUSTABLE, CURRENT SINK
PDF  11 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL5802LPL Datasheet(HTML) 4 Page - Diodes Incorporated

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AL5802LPL
Document number: DS38590 Rev. 3 - 2
4 of 11
www.diodes.com
April 2016
© Diodes Incorporated
AL5802LPL
Electrical Characteristics
– NPN Transistor – Q1 (@T
A = +25°C, unless otherwise specified.)
Symbol
Characteristic
Test Condition
Min
Typ
Max
Unit
V(BR)CEO
Collector-Emitter Breakdown Voltage (Notes 8 & 9)
IC = 1.0mA, IB = 0
40
—
—
V
V(BR)EBO
Emitter-Base Breakdown Voltage
IE = 10µA, IC = 0
6.0
—
—
V
ICEX
Collector Cutoff Current (Note 9)
VCE = 30V, VEB(OFF) = 3.0V
—
—
50
nA
IBL
Base Cutoff Current (Note 9)
VCE = 30V, VEB(OFF) = 3.0V
—
—
50
nA
hFE
DC Current Gain
IC = 1.0mA, VCE = 1.0V
IC = 10mA, VCE = 1.0V
70
100
—
—
—
300
—
VCE(SAT)
Collector-Emitter Saturation Voltage (Note 8)
IC = 10mA, IB = 1.0mA
—
—
0.20
V
VBE(SAT)
Base-Emitter Saturation Voltage
IC = 10mA, IB = 1.0mA
0.65
—
0.85
V
VBE(ON)
Base-Emitter Turn-On Voltage
VCE = 1.50V, IC = 2.0mA
0.30
—
1.10
V
Electrical Characteristics
– NPN Pre-Biased Transistor – Q2 (@T
A = +25°C, unless otherwise specified.)
Symbol
Characteristic
Test Condition
Min
Typ
Max
Unit
V(BR)CBO
Collector-Base Breakdown Voltage
IC = 50μA, IE = 0
30
—
—
V
V(BR)CEO
Collector-Emitter Breakdown Voltage (Note 8)
IC = 1mA, IB = 0
30
—
—
V
V(BR)EBO
Emitter-Base Breakdown Voltage (Note 9)
IE = 50μA, IC = 0
5.0
—
—
V
ICBO
Collector Cutoff Current
VCB = 30V, IE = 0
—
—
0.5
µA
IEBO
Emitter Cutoff Current (Note 9)
VEB = 4V, IC = 0
—
—
0.5
µA
VCE(SAT)
Collector-Emitter Saturation Voltage (Note 8)
IC = 10mA, IB = 1mA
—
—
0.3
V
VBE(ON)
Base-Emitter Turn-On Voltage
VCE = 5.0V, IC = 2.0mA
0.30
—
1.10
V
hFE
DC Current Gain (Note 8)
VCE = 5V, IC = 150mA
100
—
—
—
R1
Input Resistance
—
7
10
13
kΩ
Notes:
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design and tested only at the wafer level for single die. These parameters cannot be tested at the finished goods level due to
the testability of the device changed after packaging multiple dies to form an application circuit.



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