NCP391

http://onsemi.com

13

PACKAGE DIMENSIONS

WLCSP6, 1.31x1.04

CASE 499BP

ISSUE A

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

0.50

MILLIMETERS

A1

D

1.31 BSC

E

b

0.24

0.29

eD

0.40 BSC

0.56

D

E

A B

PIN A1

REFERENCE

eD

A

0.05

B

C

0.03 C

0.05 C

6X

b

32

A

B

0.10 C

A

A1

A2

C

0.17

0.23

1.04 BSC

0.26

6X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.60

0.10 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2

RECOMMENDED

PACKAGE

OUTLINE

eE

6X

1

eE

0.60 BSC

0.33

0.39