Specificationssubjecttochangewithoutnotification.SeeConnor-Winfield'swebsiteforlatestrevision.Alldimensionsininches.

2111 Comprehensive Drive

Aurora, Illinois 60505

Phone: 630- 851- 4722

Fax: 630- 851- 5040

www.conwin.com

Bulletin

Cx181

Page

2 of 4

Revision

05

Date

17 Sep 2013

Notes:

1.Initialcalibration@25°C.

2.Frequencystabilityvs.changeintemperature.[±(Fmax-Fmin)/(2*Fo)].

3.After30daysofoperation.

4.Peaktopeakfrequencystabilityvs.changeintemperature,frequencystabilityvs.changeinvoltage,frequencystabilityvs.changeinloadandaging

overa24hourperiod.

5.0.16seconds<Observedtime<64secondsataconstanttemperaturewith1hourwarm-up.

6.Inclusiveofcalibration@25°C,frequencyvs.changeintemperature,changeinsupplyvoltage(±5%),loadchange(±10%),shockandvibrationand

20yearsaging

7.Attention:Toachieveoptimalfrequencystability,andinsomecasestomeetthespecificationstatedonthisdatasheet,itisrequiredthatthecircuit

connectedtothisOCXOoutputmusthavetheequivalentinputcapacitancethatisspecifiedbythenominalloadcapacitance.Deviationsfromthe

nominalloadcapacitancewillhaveagraduatedeffectonthestabilityofapproximately20ppbperpFloaddifference.

Environmental Characteristics

Shock

500 G’s 1ms, Halfsine, 3 shocks per direction, per MIL-STD 202G, Method 213B Test Condition D.

SinusoidalVibration

0.06” D.A. or 10G’s Peak, 10 to 500 Hz, per MIL-STD-202G, Method 204D, Test Condition A.

RandomVibration

5.35 G’s rms. 20 to 2000 Hz per MIL-STD-202G, Method 214,Test Condition 1A, 15 minutes each axis.

Moisture

10 cycles, 95% RH, Per MIL-STD-202G, Method 112.

MarkingPermanency

Per MIL-STD-202G, Method 215J.

SolderProcessRecommendations:

RoHS compliant, lead free. See solder profile on page 3.

In-linereflow:

Refer to recommended reflow pre-heat and reflow temperatures on page 6. Package material

consist of Ryton R-4 high temperature cover with FR4 substrate. Component solder is Pb free

high temperature eutectic alloy with a melting point of 221°C.|

In-lineovenprofile:

We recommend using KIC profiler or similar device placing one of the thermocouples on the

device to insure that the internal package temperature does not exceed 221°C.

Removalofdevice

:

If for any reason the device needs to be removed from the board, use a temperature controlled

repair station with profile monitoring capabilities. Following a monitored profile will insure the

device is properly pre-heated prior to relow. Refer to IPC 610E for inspection guidelines.

RecommendedCleaningProcess:

(If required)

Device is non-hermetic, water resistance with four weep holes, one in each corner to allow

moisture to be removed during the drying cycle. We recommend in-line warm water wash

with air knife and drying capabilities. If cleaner does not have drying capability, then use hot air

circulated oven. Boards should be placed in the oven vertically for good water runoff

Device must be dried properly prior to use!

Note:Ifsaponifierisusedmakesurethedeviceisrinsedproperlytoinsureallresiduesareremoved.PHofsaponifiershouldnotexceed10.

DryingTemperature:

Between 85 to 100°C.

DryingTime:

Time will vary depending on the board size.

Caution: Do not submerge the device!

Attention:SystemDesignerspleasereviewApplicationNoteAN2093:

SystemDesignInformationandPrintedCircuitBoardLayoutGuidelinesforOCXOOscillators.

@www.conwin.com/technologies.html

Ordering Information

OscillatorType

OX914xxx-OCXO

9x14mmPackage

TemperatureRange

0=0to70°C

2=-20to70°C

3=-40to85°C

STRATUM3

S3

OutputFrequency

FrequencyFormat

-xxx.xMMin.*

-xxx.xxxxxxMMax*

*Amountofnumbersafterthe

decimalpoint.M=MHz

OX914

0

S3

-019.44M

ExamplePartNumber:

OX9140S3-019.44M=OCXO,9x14mmpackage,0to70

°C,STRATUM3,19.44MHz

**Notalloptions

availableat

Digi-Key