AR0134CSSM00SUEAH-GEVB datasheet(37/38 Pages) ONSEMI

Part #	AR0134CSSM00SUEAH-GEVB

Description	1/3-Inch 1.2 Mp CMOS Digital Image Sensor

PDF	38 Pages

Scroll/Zoom	100%

Manufacturer	ONSEMI [ON Semiconductor]

Direct Link	http://www.onsemi.com

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37 / 38 page

AR0134CS/D Rev. 8, Pub. 1/16 EN

©Semiconductor Components Industries, LLC,2016.

AR0134CS: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor

Package Dimensions

Figure 26:

48-pin iLCC Package Drawing

Notes:

1. Dimensions in mm. Dimensions in () are for reference only.

Encapsulant: Epoxy.

Substrate material: Plastic laminate 0.5 thickness.

Lid material: Borosilicate glass 0.4 ± 0.04 thickness.

Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm.

Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%.

Lead finish: Gold plating, 0.5 microns minimum thickness.

Image sensor die: 0.2mm thickness.

Maximum rotation of optical area relative to package edges: 1°.

Maximum tilt of optical area relative to substrate plane

: 25 m.

Maximum tilt of cover glass relative to optical area plane

: 50 m.

ILCC48 10x10

CASE 847AE

ISSUE O

DATE 30 DEC 2014

AR0134CSSM00SUEAH-GEVB Datasheet(PDF) 37 Page - ON Semiconductor