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PC87373 Datasheet(PDF) 158 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # PC87373
Description  LPC SuperI/O with Glue Functions
PDF  174 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

PC87373 Datasheet(HTML) 158 Page - National Semiconductor (TI)

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13.0 Device Characteristics (Continued)
158
www.national.com
Revision 1.1
13.4 AC ELECTRICAL CHARACTERISTICS
13.4.1 AC Test Conditions
Figure 46. AC Test Conditions, TA =0°Cto70°C, VSUP = 3.3V ±10%
Notes:
1. VSUP is either VDD3 or VSB3, according to the pin power well.
2. CL = 50 pF for all output pins except the following pin groups:
−
CL = 100 pF for Serial Port 1 and 2 pins (see Section 1.4.2 on page 17), Parallel Port pins (see Section 1.4.3) and
Floppy Disk Controller pins (see Section 1.4.4)
−
CL = 40 pF for IDE_RSTDRV pin
−
CL = 400 pF for SMBus pins (see SMBus Voltage Translation and Isolation Timing on page 172)
These values include both jig and oscilloscope capacitance.
3. S1 = Open − for push-pull output pins.
S1 = VSUP − for high-impedance to active low and active low to high impedance transition measurements
S1 = GND − for high-impedance to active high and active high to high impedance transition measurements
RL = 1.0 KΩ− for all the pins
4. For the FDC open-drain interface pins, S1 = VDD3 and RL = 150Ω.
Device
Under
Test
0.1
µf
Input
Output
RL
CL
S1
Load Circuit
AC Testing Input, Output Waveform
VSUP
2.4
0.4
2.0
0.8
Test Points
2.0
0.8
(unless otherwise specified)



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